Full Chip Design Services

In pursuit of doing business better and smarter, semiconductor companies have shifted from being all-in-one roof to EDA-lite, IP-lite, FAB-lite and now Design-lite. Design-lite as a trend signifies outsourcing of derivative designs from design houses while their core R & D team can focus on next product line. All major semiconductor vendors are now looking at not just augmenting their project teams by external consultants, but to transfer full ownership of their designs to capable partners. Recognizing this trend early, MindTree has moved up the value chain well in advance by offering end-to-end full chip design services to its customers.

MindTree has the required technical team, skilled engineering and program managers and stringent qualities processes to take full ownership of a medium complex full chip designs. This has been reflected in the several successful full chip tape-outs by MindTree teams in the recent months.

Our offerings

MindTree offers all the services involved in articulating &translating a specification to a full chip (GDS II / samples) design along with all the program management, supply chain management, process and quality control, etc. The diagram below depicts the various complexities, tools, technology and key activities which are our focus under this service umbrella.

Accomplishments

• Taped-out 4 successful chip-designs in the financial years 2010-2011 & 2011~2012
• Currently working on 3rd derivative of Audio chip
• Developed deep domain understanding in the Audio / DSP Domain &Bluetooth
• Proven efficient program & engineering management processes for successful execution

Why MindTree?

• Proven Execution Strategy - RAINBOW

Full chip execution involves number of independent closed loops across various streams to have a holistic view of quality - PPA goals, yet perfecting every stream and meeting the schedule. The execution strategy ensures quality deliverables of each stream, measure of the impact on the subsequent ones and to become decisive about Performance-Power-Area goals (and schedule) on the product.

• Strong proven program &engineering management process ensures quality and tracking.
• Engineering dashboards, trackers enable better tracking of the program apart from customer specific quality process ensuring quality & schedule with minimal overhead.
• Competent &experienced team which understands all the key challenges associated with a full-chip execution. Through multiple tape-outs our engineering & program management team is well equipped to handle full chip programs.
• Also provide post-silicon bring up &validation / CSL development as a value-added service for the full chip designs MindTree executes and work closely with our customers to introduce the fully tested chips faster in the market.
• Flexible business models including full & partial turn-key, sub-chip & full chip ownerships thus de-risking customers of all the cost / time overruns and overall plan for chip-to-market.

Sample Case Studies

• Full SoC Development for 8 Channel PWM Processor in 180nm
• Full Chip Development for a DSP based Low Power SoC in 90nm
• Full Chip Development for 4-Channel Audio Processor in 90 nm
• Full SoC Development of a Multimedia SoC in 180 nm
• Multiple ARM 9 & 11 Sub-Chip in 65 nm & 45 nm
• ARM-11 Series based SoC development for Military Applications
• Full Chip Development of Bluetooth RF Chip in 65 nm (Internal Chip as per MindTree’s BT Roadmap)
• Design Migration from TSMC to UMC in 90 nm
• Standalone Li-Ion Battery Charger in 0.5 um
• Digital Sub-Chip Development for 8-Channel PWM Processor in 180nm (Currently in Execution)